NoelTech

Thermal Oxide

Noel’s oxidation process has been developed over decades of experience and production expertise to configure our customized diffusion furnaces.

Thermal Oxidation

Noel’s oxidation process has been developed over decades of experience and production expertise to configure our customized diffusion furnaces. Noel specializes in providing very tight tolerances on thin oxides, 100A to thick oxides, 2.5um

Utilizing low profile cantilevers, special perforated panels to facilitate cleaner operation of each run. Each lot is transferred with automated transfer equipment.  These are all critical to Noel Class 100 Clean Room.

THERMAL OXIDE PROCESS (R.I. 1.46 +/-0.02)

Thickness Range:

<500A  – 2KA Dry  +/-10%

2KA-2.5um Wet +/-5%

WIWNU:  Wafer-within-Wafer Non-Uniformity:  +/-5% @ Range

50mm
2 Inch
100mm
4 Inch
125mm
5 Inch
150mm
6 Inch
200mm
8 Inch
300mm
12 Inch

One map per cassette as standard.  Oxide Thickness is measured on a Noel Silicon Test Wafer with

1-50 Ohms-cm resistivity. Please note, mixed resistivity material could result in non-uniformity.

SC1/SC2/SRD is available upon request.

Have a Project in Mind?

Scroll to Top